Mechatronics Zone Blog

New 3D-Printing Process Replaces Layering with Faster, Laser-Resin Process

By Elizabeth Montalbano | January 11, 2018

As 2018 begins, 3D printing—which only a few years ago was a relatively new technology—has reached the mainstream. However, researchers continue to explore the ways to improve the technology and the process of 3D printing, as well as vary the range of materials that can be used.

Uber Will Put Nvidia Under the Hood of its Autonomous Cars

By Chris Wiltz | January 10, 2018

Nvidia and Uber have entered into a partnership that will make the chipmaker's GPUs the processors of choice inside the ride-sharing company's fleet of autonomous cars and freight trucks. The announcement came out of the 2018 Consumer Electronics Shows (CES) and marks a significant step in Nvidia becoming a major supplier of processing technologies for self-driving vehicles as its Drive PX series of autonomous vehicle computing platforms will be the brains of Uber's self-driving cars and trucks. 

Build an Arduino-based 4-Channel Data Logger

By William Grill | January 10, 2018

In many applications data collection is remote and Wi-Fi and Internet are not available.

In addition and in lieu of other backup opportunities, a simple on-demand logger would be a nice resource for custom applications that can accommodate the simple handshake protocol and have a serial output available to be saved into the removable SD card.

LG, NXP, Hella Team Up on New ADAS Vision System

By Charles Murray | January 9, 2018

Three major automotive suppliers announced this week that they are teaming up to create an autonomous car vision platform that can be customized to serve the needs of any vehicle.

IoT Smart Sensors Use Cloud for Low Power Motor Condition Monitoring

By Al Presher | January 9, 2018

Condition monitoring, a technology that has been slowly moving forward for a number of years, is reaching toward its potential with new solutions for low voltage motors. Monitoring the operating condition of motors has obvious availability and productivity benefits, enabling a new level of preventive maintenance. But now the combination of compact sensors, cloud connectivity, and application software is creating a new level of operating data transparency.

Adaptive Design Offer New Concept for Packaging OEMs

By Al Presher | January 8, 2018

New concepts in packaging machinery design and development, using base machine modules that can be configured to support “batch size of one” production goals, are incorporating a combination of integrated hardware and software solutions. The result is new concept for machines that have a greater ability to changeover on-the-fly by deploying a common base machine platform designed to be more readily adaptable to constant size and format changes.

MIT Researchers Find Melting Hinders Some Sprayed Metal Coatings

By Tracey Schelmetic | January 8, 2018

Since the dawn of metalworking, the conventional wisdom has been that to join metals, there must be localized melting at the two places to be joined. In the case of metal coatings, manufacturers have long relied on a process similar to spray painting to apply metal to surfaces. Despite the ubiquity of the technique, no one was ever quite certain what happened at the particle level when metal coatings were sprayed, as the process is so fast. Understanding this could lead to new ways to apply coatings or 3D print using metals.

Design News Announces 2018 Golden Mousetrap Awards Finalists, Lifetime Achievement Award Winner Dr. John B. Goodenough

By Design News Staff | January 8, 2018

Pacific Design & Manufacturing, Anaheim, Golden Mousetrap Awards, GMTs, Lindsay Craig, Linz Craig, Cees Links, Gadget Freak, Allied Electronics, David Prutchi, Rising Engineering Star

Vote for the 2018 DesignCon Engineer of the Year

By Naomi Price | January 8, 2018

It’s time to cast your vote for the 2018 DesignCon Engineer of the Year. This award is given out each year during DesignCon and seeks to recognize the best of the best in engineering and new product advancements at the chip, board, or system level, with a special emphasis on signal integrity and power integrity.